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分子式:Cu(BF4)2
相对分子量:237.16
CAS NO:38465-60-0
执行标准:QXC14-2014
质量指标:
产品性状:深兰色液体,相对密度约1.53。
用途:铜和铜合金电镀液的组成物。
包装:用聚乙烯塑料桶包装, 每桶净重25kg,250kg。
储运及安全防护:装卸时,轻拿轻放。接触皮肤后应立即用水冲洗。
英文版
Copper fluoroborate (plating grade)
Molecular formula: Cu(BF4)2
Relative molecular weight: 237.16
CAS NO: 38465-60-0
Executive standard: Q/XC14-2014
Item | Index |
Copper fluoroborate (base on Cu2+), % ≥ | 12.0 |
Free fluoroboric acid (HBF4), % ≤ | 2.0 |
Free boric acid (HBO3), % ≤ | 1.0 |
Cl-, % ≤ | 0.005 |
Iron (Fe), % ≤ | 0.01 |
Sulfate (SO42-), % ≤ | 0.005 |
Properties: dark blue liquid, relative density is about 1.53
Use: It is the component of electroplate liquid for copper and copper alloy.
Packing: Pack in 30kg or 250kg polyvinyl plastic drum.
Storage, transportation & safety protection: It should be stored in shady, cool and ventilated warehouses.